IPC 9703 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
Hardcopy
11-08-2019
English
1 SCOPE
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 American Society for Testing and Materials
3 TERMS AND DEFINITIONS
4 USE CONDITIONS OVERVIEW
4.1 Scope and Application of UCs
4.2 Capturing UC Data
4.3 Methods for Developing UCs
4.3.1 Approach 1 - UC Derivation Approach
4.3.2 Approach 2 - Leveraging Existing Data to
Usage Model
4.3.3 Torture Tests
5 SYSTEM TESTS
5.1 Shock Test Equipment
5.1.1 Drop Testers
5.1.2 Shock Machines
5.1.3 Inclined Impact
5.1.4 Fixturing
5.2 Correlation Criteria
5.2.1 Unpackaged System Input Correlated to
Packaged System Environment
5.2.2 Unpackaged System Input Correlated to
End User Use-Conditions
5.3 Test Recommendations
5.3.1 Testing Sample Recommendations
5.4 Test Flow
5.4.1 Packaged System Testing
5.4.2 Unpackaged System Testing
5.5 Post Test Analysis
5.6 Testing Output and Report Recommendations
5.6.1 General Considerations
5.6.2 Electrical Testing
5.6.3 Failure Analysis Considerations
5.6.4 Reporting Recommendations for Test
Development
6 SYSTEM BOARD LEVEL TESTING
6.1 Board Testing Background
6.2 System Board Testing Recommendations
6.3 Correlation Criteria and Validity of Test Setup
6.4 Equipment Recommendations
6.5 Test Flows
6.6 Failure Analysis
6.7 Reporting Recommendations
7 COMPONENT MECHANICAL SHOCK ASSESSMENT
7.1 Component Assessment - General Considerations
7.2 Component Board Testing Recommendations
7.3 Correlation Criteria and Validity of Test Setup
7.4 Equipment Recommendations
7.5 Testing Flows
7.5.1 Characterization Testing
7.5.2 Qualification Testing
7.6 Failure Analysis
7.7 Reporting Recommendations
8 METRICS FOR MATCHING TEST
8.1.1 Acceleration Based Method
8.1.2 Board Strain Based Method
Annex A - Sample Data Reporting Format
Annex B - Metrologies
Annex C - Shock Failure Analysis of Electronic Components
Annex D - Suggestions for Selecting Sample Size
Annex E - Suggestions for Finite Element Analysis in
Mechanical Shock
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