Name: IPC J STD 003 CHINESE : B
Brand: IPC

SOLDERABILITY TESTS FOR PRINTED BOARDS

Published date

01-19-2009

Publisher

Institute of Printed Circuits

DevelopmentNote	Chinese translation of C2013 Edition issued in November 2015. (04/2016) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Current

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0	TEST METHODS MANUAL
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC 1601 : 0	PRINTED BOARD HANDLING AND STORAGE GUIDELINES

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IPC J STD 003 CHINESE : B