IPC TR 465 3 : -

Superseded

View Superseded by

EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A

Available format(s)

Hardcopy

Superseded date

01-28-2018

Language(s)

English

Publisher

Institute of Printed Circuits

Gives the results of a two-year study for determining the effect of steam aging exposure on components, using a variety of solderable finishes. Tests identify parts which have undesirable surface anomalies.

DocumentType	Standard
Pages	21
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC BGAWEB : 2003

IPC TR 461 : 1979	SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
IPC TR 465 1 : 1993	ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY
IPC TR 462 : 0	SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
IPC TR 466 : 1995	TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST
IPC TR 465 2 : 1993	THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
IPC TR 464 : 0	ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS

IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS