Customer Support: +1 416-401-8730

Login to i2i Subscription Intertek.com
  • There are no items in your cart
Please enter a keyword to search
Advanced search
Home
IPC
IPC TR 466 : 1995

IPC TR 466 : 1995

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST

Withdrawn date

09-13-2023

Published date

11-23-2012

Publisher

Institute of Printed Circuits

This test report was developed by the IPC Wetting Balance Task Group. The program was established for the study of precision of weight measurements taken on the wetting balance and to correlate weight measurements among test participants. The technical report discusses the results of the Task Group efforts to date on studying wetting balance weight measurement precision to establish correlation among all the test users and equipment manufacturers.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn

IPC TR 461 : 1979 SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
IPC TR 465 1 : 1993 ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY
IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
IPC TR 465 2 : 1993 THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
IPC TR 464 : 0 ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS

IPC TR 464 : 0 ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS
IPC TR 465 1 : 1993 ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY
IPC TR 465 3 : - EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A
IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
IPC TR 461 : 1979 SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
IPC TR 465 2 : 1993 THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

or

Get in touch with us