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NF EN 60749-20 : 2010

NF EN 60749-20 : 2010

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

Superseded date

11-01-2021

Published date

01-12-2013

Publisher

Association Francaise de Normalisation

AVANT-PROPOS
INTRODUCTION
1 Domaine d'application et objet
2 Références normatives
3 Description générale
4 Appareillage d'essai et matériaux
5 Procédure
6 Informations à inclure dans la spécification applicable
Annexe A (normative) Méthode de controle par tomographie
                        acoustique
Annexe B (informative) Précisions et descriptions de la
                        méthode d'essai sur la résistance des
                        CMS à boîtier plastique à l'effet
                        combiné de l'humidité et de la chaleur
                        de soudage
Annexe ZA (normative) Références normatives à d'autres
                        publications internationales avec les
                        publications européennes correspondantes

Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).

DevelopmentNote
Indice de classement: C96-022-20. (12/2003) Supersedes NF EN 60749. (06/2007) PR NF EN 60749-20 September 2007. (09/2007)
DocumentType
Standard
PublisherName
Association Francaise de Normalisation
Status
Superseded
SupersededBy

Standards Relationship
DIN EN 60749-20:2010-04 Identical
IEC 60749-20:2008 Identical
NBN EN 60749-20 : 2010 Identical
I.S. EN 60749-20:2009 Identical
UNE-EN 60749-20:2004 Identical
BS EN 60749-20:2009 Identical
EN 60749-20:2009 Identical

NF EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
NF EN 60749-37 : 2008 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
NF EN 60749-3 : 2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
NFC 20 720 : 87 AMD 1 1988 BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING
IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

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