NF EN IEC 60749-20:2020
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Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Available format(s)
Hardcopy
Language(s)
English - French
Published date
10-01-2020
Publisher
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
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