PD ES 59008-5-1:2001
Current
The latest, up-to-date edition.
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die
Hardcopy , PDF
English
07-15-2001
This European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die with or without connection structures, and minimally-packaged semiconductor die.
This specification also gives recommendations for general industry good practice for handling bare die, with or without connection structures and minimally-packaged die.
ES 59008-5-1 specifies particular requirements and recommendations for bare die and wafers that are not contained elsewhere in this series of specifications.
This specification is for use by semiconductor manufacturers, suppliers, die processors and users of semiconductor die.
ES 59008-5-1 is to be read in conjunction with ES 59008-1, General requirements, and ES 59008-3, Mechanical, material and connectivity requirements, and, where relevant, ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4.
Important note : All end users must be registered with an Account prior to user licenses being assigned.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.