SEMI 3D9 : 2014

Name: SEMI 3D9 : 2014
Brand: SEMI

Superseded

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GUIDE FOR DESCRIBING MATERIALS PROPERTIES FOR A 300 MM 3DS-IC WAFER STACK

Superseded date

10-05-2020

Published date

10-06-2014

Publisher

Semiconductor Equipment & Materials Institute

Pertains to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure wafer stacks to be used in a 3DS-IC process.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (09/2014)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Superseded
SupersededBy	SEMI 3D9:2014(R2020)

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SEMI 3D9 : 2014

GUIDE FOR DESCRIBING MATERIALS PROPERTIES FOR A 300 MM 3DS-IC WAFER STACK

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