Name: SEMI E72 : 2016
Brand: SEMI

SPECIFICATION AND GUIDE FOR 300 MM EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines limits on the footprint, height, and weight of production equipment for wafers of 300 mm or greater diameter.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Current

SEMI E106 : 2004	OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS
SEMI E149 : 2014	GUIDE FOR EQUIPMENT SUPPLIER-PROVIDED DOCUMENTATION FOR THE ACQUISITION AND USE OF MANUFACTURING EQUIPMENT
SEMI F107 : 2009	GUIDE FOR PROCESS EQUIPMENT ADAPTER PLATES
SEMI E117 : 2017	SPECIFICATION FOR RETICLE LOAD PORT
SEMI E6 : 2014	GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION

SEMI E154 : 2014	MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT
SEMI E15-1 : 2005(R2010)	SPECIFICATION FOR 300 MM TOOL LOAD PORT
SEMI E140 : 2012	GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR GAS DELIVERY SYSTEMS
SEMI E35 : 2012	GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

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SEMI E72 : 2016