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SEMI P18 : 1992(R2004)

SEMI P18 : 1992(R2004)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Definitions for overlay capabilities of wafer steppers are established, consistent with the primary application of wafer stepper (i.e. manufacture of very large scale integrated circuits). Included also are definitions for associated parameters: exposure field, registration, alignment and good fields.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

BS IEC 62899-301-2:2017 Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
SEMI P28 : 1996(R2007) SPECIFICATION FOR OVERLAY-METROLOGY TEST PATTERNS FOR INTEGRATED-CIRCUIT MANUFACTURE
SEMI 3D15 : 2016 GUIDE FOR OVERLAY PERFORMANCE ASSESSMENT FOR 3DS-IC PROCESS
14/30317965 DC : 0 BS EN 62903-2 ED.1 - PRINTED ELECTRONICS - EQUIPMENT - CONTACT PRINTING - RIGID MASTER - PART 2: MEASUREMENT METHOD OF PLATE MASTER PATTERN DIMENSION
IEC 62899-301-2:2017 Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

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