SEMI T7:2016(R2022)
Current
Current
The latest, up-to-date edition.
Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
Available format(s)
Hardcopy
Language(s)
English
Published date
04-01-2022
This Specification is intended to provide a marking symbology that can be used to mark silicon wafers with minimal intrusion into the fixed quality area of the wafer.
Important note : All end users must be registered with an Account prior to user licenses being assigned.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.