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SEMI
SEMI T7 : 2016

SEMI T7 : 2016

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL

Superseded date

05-11-2022

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Specifies the geometric shape, size and content (including the error checking and correcting code) of a rectangular two-dimensional (2-D), machine-readable, binary data matrix code symbol for back surface marking of double-side polished silicon wafers with diameters of 300 mm and 450 mm that comply with SEMI M1.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI M8 : 2012 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS
SEMI M49 : 2016 GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS
SEMI M38 : 2012(R2018) SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS
SEMI T3 : 2013 SPECIFICATION FOR WAFER BOX LABELS
SEMI M76 : 2010 SPECIFICATION FOR DEVELOPMENTAL 450 MM DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI M24 : 2007 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS
SEMI M1 : 2017 SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI 3D16 : 2016 SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING
SEMI M74 : 2008(R2018) SPECIFICATION FOR 450 MM DIAMETER MECHANICAL HANDLING POLISHED WAFERS
SEMI T14 : 2005 SPECIFICATION FOR MICRO ID ON 300 MM SILICON WAFERS
SEMI E174 : 2017 SPECIFICATION FOR WAFER JOB MANAGEMENT (WJM)
SEMI T17 :2006(R2018) SPECIFICATION OF SUBSTRATE TRACEABILITY
SEMI E118 : NOV 2004E SPECIFICATION FOR WAFER ID READER COMMUNICATION INTERFACE - THE WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE
NASA STD 6002 : 2008 APPLYING DATA MATRIX IDENTIFICATION SYMBOLS ON AEROSPACE PARTS
NASA HDBK 6003 : 2008 APPLICATION OF DATA MATRIX IDENTIFICATION SYMBOLS TO AEROSPACE PARTS USING DIRECT PART MARKING METHODS/TECHNIQUES
SEMI M62 : 2017 SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS
SEMI 3D2 : 2016 SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS
SEMI M57 : 2016 SPECIFICATION FOR SILICON ANNEALED WAFERS
SEMI PV81 : 2018 GUIDE FOR SPECIFYING LOW PRESSURE HORIZONTAL DIFFUSION FURNACE

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