Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-12-2016

Publisher

British Standards Institution

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

Committee	EPL/47
DevelopmentNote	Supersedes 05/30132033 DC. (01/2008) Supersedes 13/30284025 DC. (12/2016)
DocumentType	Standard
Pages	24
PublisherName	British Standards Institution
Status	Current
Supersedes	13/30284025 DC : 0 BS EN 60191-6-13:2007 05/30132033 DC : DRAFT APR 2005

Standards	Relationship
EN 60191-6-13:2016	Identical
DIN EN 60191-6-13:2013-07 (Draft)	Identical
NF EN 60191-6-13 : 2017	Identical
I.S. EN 60191-6-13:2016	Identical
IEC 60191-6-13:2016	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-2:2012 DB	Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages