PD IEC/TR 62866:2014
Current
The latest, up-to-date edition.
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Hardcopy , PDF
English
07-05-2014
This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
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