SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2007

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
  4.1 Method of gripping
  4.2 Method of loading
  4.3 Speed of testing
  4.4 Force measurement
  4.5 Elongation measurement
  4.6 Stress-strain curve
  4.7 Environment control
5 Test piece
  5.1 General
  5.2 Plane shape of test piece
  5.3 Test piece thickness
  5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10[mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

DevelopmentNote	Supersedes DIN IEC 62047-2. (02/2007)
DocumentType	Standard
Pages	14
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current
Supersedes	DIN IEC 62047-2:2004-08 (Draft)

Standards	Relationship
IEC 62047-2:2006	Identical
EN 62047-2:2006	Identical
NBN EN 62047-2 : 2007	Identical
I.S. EN 62047-2:2006	Identical
NF EN 62047-2 : 2006	Identical
BS EN 62047-2:2006	Identical