Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Published date

16-06-2017

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography

IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.This edition includes the following significant technical changes with respect to the previous edition:a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;b) additional variant – ‘adhesive tape pull test’.

Committee	CLC/SR 47
DevelopmentNote	Supersedes EN 60749. (06/2017)
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current
Supersedes	EN 60749 : 99 AMD 2 2001

Standards	Relationship
IEC 60749-9:2017	Identical
NF EN 60749-9 : 2002	Identical
UNE-EN 60749-9:2003	Identical
NBN EN 60749-9 : 2003	Identical
NEN EN IEC 60749-9 : 2017	Identical
I.S. EN 60749-9:2017	Identical
PN EN 60749-9 : 2017	Identical
UNE-EN 60749-9:2017	Identical
NF EN 60749-9:2017	Identical
BS EN 60749-9:2002	Identical
CEI EN 60749-9 : 2004	Identical
DIN EN 60749-9:2016-09 (Draft)	Identical
BS EN 60749-9:2017	Identical

IEC 61340-2-3:2016	Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation
FED-STD-101 Revision C:1980	TEST PROCEDURES FOR PACKAGING MATERIALS