SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST

Published date

31-08-2007

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Flow soldering equipment
   5.2 Reflow soldering equipment
   5.3 Pull strength test equipment
   5.4 Optical microscope
   5.5 Test substrate
   5.6 Solder alloy
   5.7 Flux for flow soldering
   5.8 Solder paste
6 Mounting method
   6.1 Flow soldering
   6.2 Reflow soldering
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Pull strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial pull strength measurement
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final pull strength measurement
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) - Pull strength test - Details
Bibliography
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components.

Committee	SR 91
DocumentType	Test Method
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NEN EN IEC 62137-1-1 : 2007	Identical
IEC 62137-1-1:2007	Identical
I.S. EN 62137-1-1:2007	Identical
PN EN 62137-1-1 : 2008	Identical
UNE-EN 62137-1-1:2007	Identical
NBN EN 62137-1-1 : 2008	Identical
BS EN 62137-1-1:2007	Identical
NF EN 62137-1-1 : 2014	Identical
CEI EN 62137-1-1 : 2008	Identical
DIN EN 62137-1-1:2008-02	Identical

BS EN 62137-3:2012	Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
CEI EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
I.S. EN 62137-3:2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
EN 62137-3:2012	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
EN 61249-2-7:2002/corrigendum:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007	Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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EN 62137-1-1 : 2007

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

Category

Subcategory