I.S. EN 16602-70-28:2014
Current
The latest, up-to-date edition.
SPACE PRODUCT ASSURANCE - REPAIR AND MODIFICATION OF PRINTED CIRCUIT BOARD ASSEMBLIES FOR SPACE USE
Hardcopy , PDF
English
01-01-2014
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Foreword
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Requirements
Annex A (informative) - Removal of conformal coating
Annex B (informative) - Solder joint removal and unclinching
Annex C (informative) - Repair of damaged gold-plated
areas
Annex D (informative) - Repair of damaged conductor tracks
Annex E (informative) - Repair of lifted conductors
Annex F (informative) - Repair of lifted terminal areas (pads)
Annex G (informative) - Terminal post replacement
Annex H (informative) - wire-to-wire joints
Annex I (informative) - Addition of components
Annex J (informative) - Removal and replacement of axial
and multi-lead Components
Annex K (informative) - Removal and replacement of
flat-pack Components
Annex L (informative) - Modification of component
connections
Annex M (informative) - Cutting of internal track of a
multi-layer printed circuit board
Bibliography
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