Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

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Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

07-04-2011

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope and object
2 Terms and definitions
3 Classification and levels
4 Apparatus and material
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - Examples of special pins that are
        connected to passive components
Annex B (informative) - Calculation of operating ambient
        or operating case temperature for a given operating
        junction temperature

IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include:
- a number of minor technical changes;
- the addition of two new annexes covering the testing of special pins and temperature calculations.

Committee	TC 47
DevelopmentNote	Supersedes IEC PAS 62181. (11/2003) Stability Date: 2015. (10/2012)
DocumentType	Standard
Pages	52
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60749-29:2003 IEC PAS 62181:2000

Standards	Relationship
NF EN 60749-29 : 2012	Identical
NBN EN 60749-29 : 2011	Identical
NEN EN IEC 60749-29 : 2011	Identical
PN EN 60749-29 : 2011	Identical
UNE-EN 60749-29:2004	Identical
CEI EN 60749-29 : 2012	Identical
EN 60749-29:2011	Identical
DIN EN 60749-29:2012-01	Identical
I.S. EN 60749-29:2011	Identical
BS EN 60749-29:2011	Identical
UNE-EN 60749-29:2011	Identical

BS EN 60749-43:2017	Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
I.S. EN 60749-43:2017	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
IEC TS 62686-1:2015	Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
EN 60749-43:2017	Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
13/30264591 DC : 0	BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
15/30269562 DC : 0	BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS
CEI EN 60749-43 : 1ED 2018	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
PD IEC/TS 62686-1:2015	Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
IEC 60749-43:2017	Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

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IEC 60749-29:2011

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

Table of Contents

Abstract

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International Equivalents

Standards Referenced By This Book

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