Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French, Spanish, Castilian

Published date

10-02-1999

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers

Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

Committee	TC 91
DevelopmentNote	Stability Date: 2018. (09/2017)
DocumentType	Standard
Pages	12
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 61249-3-5 : 2002	Identical
NEN EN IEC 61249-3-5 : 1999	Identical
I.S. EN 61249-3-5:1999	Identical
PN EN 61249-3-5 : 2002	Identical
SN EN 61249-3-5 : 1999	Identical
BS EN 61249-3-5:1999	Identical
EN 61249-3-5:1999	Identical
DIN EN 61249-3-5:1999-11	Identical
UNE-EN 61249-3-5:2000	Identical

IEC 60249-2-8:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
IEC 60249-2-15:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
IEC 60249-2-13:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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IEC 61249-3-5:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory