IEC 62137-3:2011
Current
The latest, up-to-date edition.
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
08-11-2011
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Procedure of selecting the applicable test method
6 Common subjects in each test method
7 Evaluation test method
Annex A (informative) - Condition of rapid temperature
change
Annex B (informative) - Electrical continuity test for
solder joint
Annex C (informative) - Torque shear strength test
Annex D (informative) - Monotonic bending strength test
Annex E (informative) - Cyclic steel ball drop strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Evaluation method for the fillet lifting
phenomenon of a lead insertion type device solder joint
Bibliography
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