IPC 4103 : A

Superseded

View Superseded by

SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS

Amended by

IPC 4103 : A : AMD 1

Available format(s)

Hardcopy

Superseded date

11-03-2018

Publisher

Institute of Printed Circuits

1 GENERAL
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES

Provides the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits.

DevelopmentNote	Supersedes IPC L 125. (12/2001) Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008) Included in IPC C 105. (12/2011) Also available in Hardcopy format. (03/2018)
DocumentType	Standard
Pages	96
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC-4202C:2022
Supersedes	IPC L 125 : A IPC 4103 : 0

IPC 2222 FRENCH : A2010	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 2252 : 0	DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS
IPC 2222 : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 2141 : A	DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
BS IEC 61182-2:2006	Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 2581 : B	GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IPC 2221 GERMAN : B	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IEC PAS 61182-12:2014	Generic requirements for printed board assembly products manufacturing description data and transfer methodology
IPC 2222 CHINESE : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6018 CHINESE : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 2222 GERMAN : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
PD IEC/PAS 61182-12:2014	Generic requirements for printed board assembly products manufacturing description data and transfer methodology
IPC 2251 : 0	DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 2221 FRENCH : B2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
DSCC 10012 : 0	PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
IEC 61182-2:2006	Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements