MIL-PRF-55681 Revision G:2016
Current
The latest, up-to-date edition.
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - EQUIVALENT SERIES RESISTANCE MEASUREMENT CRITERIA
FOR HIGH FREQUENCY CAPACITOR STYLES CDR11 THROUGH CDR14
AND CDR21 THROUGH CDR25
APPENDIX B - PROCEDURE FOR QUALIFICATION INSPECTION
APPENDIX C - VISUAL INSPECTION CRITERIA
Specifies the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors.
Committee |
FSC 5910
|
DevelopmentNote |
Supersedes MIL C 55681 (D) (07/2001)
|
DocumentType |
Standard
|
Pages |
91
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
Current
|
Supersedes |
18/30373170 DC : 0 | BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
MIL-PRF-55681-4 Revision H:2015 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY) |
DSCC 09027 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210 |
DSCC 05007 : F | CAPACITORS, FIXED, CERAMIC, CHIP, 1206 |
MIL-PRF-83531 Revision D:2014 | DELAY LINES, PASSIVE, GENERAL SPECIFICATION FOR |
DSCC 91019 : K | CAPACITOR, FIXED, CERAMIC, CHIP, .56 [MU]F THROUGH 1 [MU]F |
DSCC 14005 : 0 | CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0508 |
DSCC 09023 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201 |
DSCC 88013 : G | DELAY LINES, PASSIVE, 3-PIN, SIP |
DSCC 06019 : B | CAPACITOR, FIXED, CERAMIC, CHIP, HIGH FREQUENCY |
DSCC 05006 : F | CAPACITORS, FIXED, CERAMIC, CHIP, 0805 |
DSCC 03029 : E | CAPACITOR, FIXED, CERAMIC, CHIP, 0402 |
DSCC 94006 : D | CAPACITORS, FIXED, CERAMIC, CHIP |
DSCC 05002 : G | CAPACITOR, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP |
DSCC 05003 : E | CAPACITOR, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP |
DSCC 09026 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805 |
DSCC 05001 : F | CAPACITOR, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP |
NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
DSCC 89089 : C | CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE |
DSCC 09025 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603 |
MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
DSCC 84035 : D | DELAY LINES, PASSIVE, 10-TAP, DUAL-IN-LINE, 16-PIN |
DSCC 09024 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402 |
DSCC 06022 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY |
IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
MIL-HDBK-198 Revision B:2012 | CAPACITORS, SELECTION AND USE OF |
DSCC 03028 : E | CAPACITORS, FIXED, CERAMIC, CHIP, 0603 |
DSCC 14004 : 0 | CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0306 |
MIL-STD-202-211 Base Document:2015 | METHOD 211, TERMINAL STRENGTH |
MIL-STD-202-302 Base Document:2015 | METHOD 302, INSULATION RESISTANCE |
MIL-STD-202-210 Base Document:2015 | METHOD 210, RESISTANCE TO SOLDERING HEAT |
MIL-STD-202-305 Base Document:2015 | METHOD 305, CAPACITANCE |
IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
MIL-STD-202-107 Base Document:2015 | METHOD 107, THERMAL SHOCK |
IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
MIL-STD-202-106 Base Document:2015 | METHOD 106, MOISTURE RESISTANCE |
MIL-STD-202-301 Base Document:2015 | METHOD 301, DIELECTRIC WITHSTANDING VOLTAGE |
IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
MIL-STD-790 Revision G:2011 | ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS |
MIL-STD-202-104 Base Document:2015 | METHOD 104, IMMERSION |
MIL-STD-202-103 Base Document:2015 | METHOD 103, HUMIDITY (STEADY STATE) |
MIL-STD-202-108 Base Document:2015 | METHOD 108, LIFE (AT ELEVATED AMBIENT TEMPERATURE) |
MIL-STD-202-208 Base Document:2015 | METHOD 208, SOLDERABILITY |
MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.