NBN EN 60749-20 : 2010
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
12-01-2013
INTRODUCTION
1 Scope and object
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Information to be given in the relevant specification
Annex A (normative) Methods of inspection by acoustic
tomography
Annex B (informative) Details and descriptions of test method
on resistance of plastic-encapsulated SMDs to the
combined effect of moisture and soldering heat
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
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