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NBN EN 61191-3 : 1999

Current

Current

The latest, up-to-date edition.

PRINTPLAATSAMENSTELLINGEN - GROEPSSPECIFICATIE - EISEN VOOR DOOR GATEN GESTOKEN, GESOLDEERDE SAMENSTELLINGEN

Published date

12-01-2013

Contents
Clause
1. General
    1.1 Scope
    1.2 Classification
2. Normative references
3. Through-hole technology (THT)
4. Through-hole mounting of components
    4.1 Placement accuracy
    4.2 Through-hole component requirements
5. Acceptance requirements
    5.1 Control and corrective actions
    5.2 Through-hole component lead soldering
6. Rework of unsatisfactory solder connections
Annex A (normative) Placement requirements for through-hole
mount devices
Annex ZA Normative references to international publications
with their corresponding European publications

Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)

DocumentType
Standard
PublisherName
Belgian Standards
Status
Current

Standards Relationship
DIN EN 61191-3:2016-01 (Draft) Identical
BS EN 61191-3:2017 Identical
EN 61191-3:2017 Identical
I.S. EN 61191-3:2017 Identical
NF EN 61191-3 : 2000 Identical

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