NEN EN IEC 62047-16 : 2015
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS
Published date
18-08-2015
Publisher
Explains test method for bonding strength between poly dimethyl siloxane (PDMS) and glass.
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