IEC 62047-16:2015
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
05-03-2015
Publisher
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing methods
Bibliography
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