FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION

Published date

12-01-2013

Publisher

La présente partie de la CEI 60384 est une spécification générique, qui s'applique aux condensateurs fixes utilisés dans les équipements électroniques. Elle établit des définitions, des procédures de controle et des méthodes d'essai normalisées à utiliser dans les spécifications intermédiaires et particulières des composants électroniques, pour les systèmes d'assurance de la qualité ou pour tout autre usage.

DevelopmentNote	Indice de classement: C93-112-1. PR NF EN 60384-1 April 2005. (04/2005) PR NF EN 60384-1 January 2007. (01/2007) PR NF EN 60384-1 November 2014. (12/2014) 2014 version is still active. (01/2017)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
BS EN 60384-1:2016	Identical
I.S. EN 60384-1:2016	Identical
DIN EN 60384-1 : 2017	Identical
EN 60384-1:2016	Identical
NBN EN 60384-1 : 2016	Identical
SN EN 60384-1 : 2016	Identical
IEC 60384-1:2016	Identical

NF EN 60384-18-2 : 2008	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18-2: BLANK DETAIL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH NON-SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
NF EN 60384-16 : 2006	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 16: SECTIONAL SPECIFICATION: FIXED METALLIZED POLYPROPYLENE FILM DIELECTRIC D.C. CAPACITORS
NF EN 60384-18-1 : 2008	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE - ASSESSMENT LEVEL EZ

IEC 60068-2-82:2007	Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-27:2008	Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-13:1983	Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
IEC 60068-2-67:1995	Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 60068-2-17:1994	Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC 60068-2-2:2007	Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-1:2007	Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60695-11-5 : 2.0	FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 60068-2-30:2005	Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)