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Superseded

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BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)

Available format(s)

Hardcopy , PDF

Superseded date

31-05-2015

Language(s)

English

Publisher

British Standards Institution

1 Scope and object
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related
   test severities
5 Test equipment
6 Test Td1: Solderability of terminations
7 Test Td2: Resistance to soldering heat
8 Test Td3: Dewetting and resistance to dissolution
   of metallization
9 Final measurements
10 Information to be given in the relevant specification
Bibliography
Annex A (normative) - Criteria for visual examination
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods
        to through hole reflow soldering components (THR)
Annex D (informative) - Group 3: T4 related to size and
        sensitivity for non-solid component

BS EN 60068-2-58 ED.4

Committee	EPL/501
DocumentType	Draft
Pages	28
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 60068-2-58 : 2015

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61760-4:2015	Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
IEC 61760-3:2010	Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60068-2-44:1995	Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications