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BS EN 60191-6-1:2001

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

29-03-2002

1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
         international publications with their
         corresponding European publications

Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

Committee
EPL/47
DevelopmentNote
Also numbered as IEC 60191-6-1. (05/2002)
DocumentType
Standard
Pages
12
PublisherName
British Standards Institution
Status
Current

Standards Relationship
NF EN 60191-6-1 : 2002 Identical
EN 60191-6-1:2001 Identical
I.S. EN 60191-6-1:2002 Identical
UNE-EN 60191-6-1:2002 Identical
DIN EN 60191-6-1:2002-08 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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£120.00
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