MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2002

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications

Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

DevelopmentNote	Supersedes DIN IEC 47D-255-CDV (08/2002)
DocumentType	Standard
Pages	10
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
NF EN 60191-6-1 : 2002	Identical
EN 60191-6-1:2001	Identical
BS EN 60191-6-1:2001	Identical
I.S. EN 60191-6-1:2002	Identical
UNE-EN 60191-6-1:2002	Identical
IEC 60191-6-1:2001	Identical