Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, Spanish, Castilian

Published date

30-10-2001

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative reference
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and co-planarity
Table

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

DevelopmentNote	Also numbered as BS EN 60191-6-1. (05/2002) Stability Date: 2021. (10/2012)
DocumentType	Standard
Pages	7
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NEN EN IEC 60191-6-1 : 2002	Identical
I.S. EN 60191-6-1:2002	Identical
PN EN 60191-6-1 : 2003	Identical
UNE-EN 60191-6-1:2002	Identical
EN 60191-6-1:2001	Identical
DIN EN 60191-6-1:2002-08	Identical
NF EN 60191-6-1 : 2002	Identical
CEI EN 60191-6-1 : 2003	Identical

EN IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
17/30352677 DC : 0	BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
I.S. EN IEC 60191-1:2018	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

IEC 60191-6:2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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IEC 60191-6-1:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

Category

Subcategory