Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-05-2001

Publisher

British Standards Institution

Defines a method for quad flat packs (QFP) measuring dimensions classified into Form E.

Committee	EPL/47
DevelopmentNote	Also numbered as IEC 60191-6-3 (05/2001)
DocumentType	Standard
Pages	20
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
DIN EN 60191-6-3:2001-06	Identical
EN 60191-6-3:2000	Identical
I.S. EN 60191-6-3:2001	Identical
NF EN 60191-6-3 : 2001	Identical

IEC 60191-6:2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages