EN 60191-6-3:2000
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Published date
04-12-2000
Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.
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