Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

29-09-2000

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Definitions
4 Measuring methods

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

Committee	TC 47/SC 47D
DevelopmentNote	Also numbered as BS EN 60191-6.3 (09/2005) A Bilingual edition has been published. (01/2013) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	17
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NEN EN IEC 60191-6-3 : 2001	Identical
I.S. EN 60191-6-3:2001	Identical
PN EN 60191-6-3 : 2002	Identical
UNE-EN 60191-6-3:2000	Identical
CEI EN 60191-6-3 : 2001	Identical
EN 60191-6-3:2000	Identical
DIN EN 60191-6-3:2001-06	Identical
NF EN 60191-6-3 : 2001	Identical

EN IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
I.S. EN IEC 60191-1:2018	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
IEC 60191-6-6:2001	Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

IEC 60191-6:2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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IEC 60191-6-3:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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