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BS EN 60749-29:2011

Current

Current

The latest, up-to-date edition.

Semiconductor devices. Mechanical and climatic test methods Latch-up test

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-08-2011

1 Scope and object
2 Terms and definitions
3 Classification and levels
4 Apparatus and material
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - Examples of special pins
        that are connected to passive components
Annex B (informative) - Calculation of operating
        ambient or operating case temperature for
        a given operating junction temperature

Specifies the I-test and the overvoltage latch-up testing of integrated circuits. It establishes a method for determining integrated circuit latch-up characteristics and to define latch-up failure criteria.

This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits.

This test is classified as destructive.

The purpose of this test is to establish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing \'no trouble found\' (NTF) and \'electrical overstress\' (EOS) failures due to latch-up.

This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established.

The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2

Committee
EPL/47
DevelopmentNote
Supersedes 02/205138 DC (03/2004) Supersedes 09/30209746 DC. (09/2011)
DocumentType
Standard
Pages
26
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
UNE-EN 60749-29:2004 Identical
NF EN 60749-29 : 2012 Identical
DIN EN 60749-29:2012-01 Identical
NBN EN 60749-29 : 2011 Identical
EN 60749-29:2011 Identical
I.S. EN 60749-29:2011 Identical
IEC 60749-29:2011 Identical

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