Customer Support: +44 (0)203 327 3140

Login to i2i Subscription Intertek.com
  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Go to AMERICAS site
Dismiss alert
Please enter a keyword to search
Advanced search
Home
BSI
BS EN 60749-35:2006

BS EN 60749-35:2006

Current

Current

The latest, up-to-date edition.

Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-11-2006

Publisher

British Standards Institution

1 Scope
2 Terms and definitions
3 Test apparatus
  3.1 Reflective acoustic microscope system
  3.2 Through transmission acoustic microscope system
  3.3 Reference packages or standards
  3.4 Sample holder
4 Procedure
  4.1 General
  4.2 Equipment setup
  4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet
        (example only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
        applicable scanned data
Bibliography

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Committee
EPL/47
DevelopmentNote
Supersedes 04/30117780 DC (12/2006)
DocumentType
Standard
Pages
24
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
DIN EN 60749-35:2007-03 Identical
I.S. EN 60749-35:2006 Identical
IEC 60749-35:2006 Identical
NF EN 60749-35 : 2006 Identical
EN 61140:2002 Identical
NBN EN 60749-35 : 2007 Identical
EN 60749-35:2006 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

View more information
£186.00
Excluding VAT
GBP
CAD
CHF
CNY
DKK
EUR
GBP
HKD
IDR
INR
JPY
KRW
MXN
NOK
NZD
SEK
SGD
USD
ZAR
Hardcopy - English
PDF - English
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

or

Get in touch with us