• There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

I.S. EN 60749-35:2006

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2006

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
  3.1 Reflective acoustic microscope system
  3.2 Through transmission acoustic microscope system
  3.3 Reference packages or standards
  3.4 Sample holder
4 Procedure
  4.1 General
  4.2 Equipment setup
  4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet (example
        only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
        applicable scanned data
Bibliography

Describes the procedures for performing acoustic microscopy on plastic encapsulated electronic components. It provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
56
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
NBN EN 60749-35 : 2007 Identical
BS EN 60749-35:2006 Identical
EN 60749-35:2006 Identical
DIN EN 60749-35:2007-03 Identical
IEC 60749-35:2006 Identical
NF EN 60749-35 : 2006 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

View more information
£73.21
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.