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BS EN 61188-1-2:1998

BS EN 61188-1-2:1998

Current

Current

The latest, up-to-date edition.

Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-12-1998

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 Engineering design overview
    3.1 Device selection
    3.2 Intraconnection
    3.3 Printed board and printed board assemblies
    3.4 Performance requirements
    3.5 Power distribution
4 Design of controlled impedance circuits
    4.1 Configurations
    4.2 Equations
    4.3 Controlled impedance design rules
    4.4 Cross-talk rules
    4.5 Coupon design rules
    4.6 Decoupling/capacitor rules
5 Design for manufacturing
    5.1 Process rules in CAD
    5.2 Design complexity and correlation to cost
6 Data description
    6.1 Details of construction
    6.2 Isolation of data by net class (noise, timing,
          capacitance and impedance)
    6.3 Electrical performance
7 Material
    7.1 Resin systems
    7.2 Reinforcements
    7.3 Prepregs, bonding layers and adhesives
    7.4 Frequency dependence
8 Fabrication
    8.1 General
    8.2 Preproduction processes
    8.3 Production processes
    8.4 Impact of defects at high frequencies
    8.5 Data description
9 Time domain reflectometry (TDR) testing
    9.1 Rationale
Annex A Units, symbols and terminology
Annex ZA Normative references to international publications
          with their corresponding European publications

Intended for use by circuit designers, packaging engineers, printed board manufacturers and procurement personnel in order that all may have a common understanding of each area. Intended to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are specified as designs where the interconnecting properties affect circuit performance and need unique considerations.

Committee
EPL/501
DevelopmentNote
Supersedes BS 6221-23(1991) (03/2001) Also numbered as IEC 61188-1-2 Supersedes 95/208504 DC (08/2004)
DocumentType
Standard
Pages
38
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
DIN EN 61188-1-2:1999-03 Identical
SN EN 61188-1-2 : 1998 Identical
EN 61188-1-2:1998 Identical
NF EN 61188-1-2 : 2000 Identical

BS 123200-003:2001 System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
BS 123300-003:2001 System of quality assessment. Capability detail specification. Rigid multilayer printed boards
BS 123100-003:2001 System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes

EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61182-1:1994 Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form

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