SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2010

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General applicability and
  reliability considerations
5 Dry packing
6 Drying
7 Use
Annex A (normative) - Symbol
        and labels for
        moisture-sensitive
        devices
Annex B (informative) - Board
        rework
Annex C (informative) - Derating
        due to factory environmental
        conditions
Bibliography

Defines to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-66. (09/2010)
DocumentType	Standard
Pages	38
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 60749-20-1:2009	Identical
EN 60749-20-1 : 2009	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-30:2005+AMD1:2011 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
EN 60749-30 : 2005 AMD 1 2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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CEI EN 60749-20-1 : 2010

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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