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EN 60191-6-21 : 2010

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)

Published date

15-10-2010

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Committee
SR 47D
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
I.S. EN IEC 60191-1:2018 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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