Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

30-08-2010

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Committee	TC 47/SC 47D
DevelopmentNote	Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	32
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 60191-6-21 : 2011	Identical
NBN EN 60191-6-21 : 2010	Identical
NEN EN IEC 60191-6-21 : 2010	Identical
PN EN 60191-6-21 : 2011	Identical
UNE-EN 60191-6-21:2010	Identical
BS EN 60191-6-21:2010	Identical
CEI EN 60191-6-21 : 2011	Identical
EN 60191-6-21 : 2010	Identical
DIN EN 60191-6-21:2011-03	Identical

EN IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
I.S. EN IEC 60191-1:2018	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-4:2013	Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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IEC 60191-6-21:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

Category

Subcategory