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IPC
IPC 2222 CHINESE : A

IPC 2222 CHINESE : A

Current

Current

The latest, up-to-date edition.

SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

Published date

04-06-2007

Publisher

Institute of Printed Circuits

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 2152 : 0 STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN
IPC TM 650 : 0 TEST METHODS MANUAL
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC 4411 : A SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT
IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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