IPC 2222 FRENCH : A2010

Name: IPC 2222 FRENCH : A2010
Brand: IPC

Superseded

SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

Superseded date

21-01-2018

Published date

01-09-2015

Publisher

Institute of Printed Circuits

DevelopmentNote	Also available in Hardcopy format. (01/2018)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 2222 : A

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 2152 : 0	STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN
IPC TM 650 : 0	TEST METHODS MANUAL
IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 4562 : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC 4411 : A	SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT
IPC 4103 : A	SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

Sorry this product is not available in your region.

Access your standards online with a subscription

Features