NEN EN IEC 60191-6-20 : 2010
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
Published date
12-01-2013
Publisher
Defines methods to measure package dimensions of small outline J-lead packages (SOJ), package outline form E in accordance with IEC 60191-4.
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