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NF EN 60191-6-20 : 2011

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)

Published date

12-01-2013

DevelopmentNote
Indice de classement: C96-013-6-20. PR NF EN 60191-6-20 August 2010. (08/2010)
DocumentType
Standard
PublisherName
Association Francaise de Normalisation
Status
Current

Standards Relationship
EN 60191-6-20:2010 Identical
IEC 60191-6-20:2010 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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