AEC Q200 : REV D
|
STRESS TEST QUALIFICATION FOR PASSIVE COMPONENTS |
SAE ARP 6379 : 2016
|
PROCESSES FOR APPLICATION-SPECIFIC QUALIFICATION OF ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AND SUB-ASSEMBLIES FOR USE IN AEROSPACE, DEFENSE, AND HIGH PERFORMANCE SYSTEMS |
SAE AS 5553B : 2016
|
COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION |
AEC Q100 : REV H
|
FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS |
EIA 933 : 2015
|
REQUIREMENTS FOR A COTS ASSEMBLY MANAGEMENT PLAN |
SAE ARP 4754 : 2010
|
GUIDELINES FOR DEVELOPMENT OF CIVIL AIRCRAFT AND SYSTEMS |
VITA 51.2 : 2016
|
PHYSICS OF FAILURE RELIABILITY PREDICTIONS |
IEC TS 62668-1 : 3.0
|
PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 1: AVOIDING THE USE OF COUNTERFEIT, FRAUDULENT AND RECYCLED ELECTRONIC COMPONENTS |
MIL HDBK 454 : B
|
GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT |
IEC TR 62240-1 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS CAPABILITY IN OPERATION - PART 1: TEMPERATURE UPRATING |
SAE AS 9100D : 2016
|
QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS FOR AVIATION, SPACE AND DEFENSE ORGANIZATIONS |
MIL HDBK 338 : B
|
ELECTRONIC RELIABILITY DESIGN HANDBOOK |
GEIA STD 0005-2 : 2012
|
MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
RTCA DO 160 : G2010 CHG 1 2014
|
ENVIRONMENTAL CONDITIONS AND TEST PROCEDURES FOR AIRBORNE EQUIPMENT |
SAE ARP 6338 : 2015
|
PROCESS FOR ASSESSMENT AND MITIGATION OF EARLY WEAROUT OF LIFE-LIMITED MICROCIRCUITS |
AEC Q101 : REV D1
|
FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR DISCRETE SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS |
IEC 62396-4:2013
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 4: DESIGN OF HIGH VOLTAGE AIRCRAFT ELECTRONICS MANAGING POTENTIAL SINGLE EVENT EFFECTS |
ESD S20.20 : 2014
|
PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) |
MIL HDBK 217 : F
|
RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
IEC TS 62564-1 : 3.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
GEIA STD 0016 : 2012
|
PREPARING A DMSMS MANAGEMENT PLAN |
IEC TS 62686-1 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
IEC 62396-5 : 2014
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 5: ASSESSMENT OF THERMAL NEUTRON FLUXES AND SINGLE EVENT EFFECTS IN AVIONICS SYSTEMS |
IEC 62396-3 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 3: SYSTEM DESIGN OPTIMIZATION TO ACCOMMODATE THE SINGLE EVENT EFFECTS (SEE) OF ATMOSPHERIC RADIATION |
SAE ARP 5890 : 2011
|
GUIDELINES FOR PREPARING RELIABILITY ASSESSMENT PLANS FOR ELECTRONIC ENGINE CONTROLS |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IEC TS 62647-1 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN |
ISO 9000 : 2015
|
QUALITY MANAGEMENT SYSTEMS - FUNDAMENTALS AND VOCABULARY |
GEIA STD 0009 : 2008
|
RELIABILITY PROGRAM STANDARD FOR SYSTEMS DESIGN, DEVELOPMENT AND MANUFACTURING |
GEIA STD 0008 : 2011
|
DERATING OF ELECTRONIC COMPONENTS |
IEC 62396-1 : 2ED 2016
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 1: ACCOMMODATION OF ATMOSPHERIC RADIATION EFFECTS VIA SINGLE EVENT EFFECTS WITHIN AVIONICS ELECTRONIC EQUIPMENT |
GEIA STD 0003 : 2006
|
LONG TERM STORAGE OF ELECTRONIC DEVICES |
J STD 020 : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
IEC TS 62647-2 : 1ED 2012
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN |