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ASTM F 1259M : 1996

ASTM F 1259M : 1996

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]

Available format(s)

Hardcopy , PDF

Superseded date

11-11-2014

Language(s)

English

Published date

01-01-1996

Publisher

American Society for Testing and Materials

CONTAINED IN VOL. 10.04, 2009 Covers recommended design features and is used in accelerated stress tests to characterize the failure distribution of interconnect metallizations that fail due to electromigration, and is restricted to structures with a straight test line on a flat surface.

1.1 This guide covers recommended design features for test structures used in accelerated stress tests, as described in Test Method F 1260, to characterize the failure distribution of interconnect metallizations that fail due to electromigration.

1.2 The guide is restricted to structures with a straight test line on a flat surface that are used to detect failures due to an open-circuit or a percent-increase in resistance of the test line.

1.3 This guide is not intended for testing metal lines whose widths are approximately equal to or less than the estimated mean size of the metal grains in the metallization line.

1.4 This guide is not intended for test structures used to detect random defects in a metallization line.

1.5 Metallizations tested and characterized are those that are used in microelectronic circuits and devices.

Committee
F 01
DocumentType
Guide
Pages
2
ProductNote
Reconfirmed 1996
PublisherName
American Society for Testing and Materials
Status
Superseded
SupersededBy
Supersedes

ASTM F 1260M : 1996 Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]

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PDF - English
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