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ASTM F 1259M : 1996 : R2003

ASTM F 1259M : 1996 : R2003

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric] (Withdrawn 2009)

Available format(s)

Hardcopy , PDF

Withdrawn date

12-31-2009

Language(s)

English

Published date

06-10-1996

Publisher

American Society for Testing and Materials

CONTAINED IN VOL. 10.04, 2009 Covers recommended design features and is used in accelerated stress tests to characterize the failure distribution of interconnect metallizations that fail due to electromigration, and is restricted to structures with a straight test line on a flat surface.

1.1 This guide covers recommended design features for test structures used in accelerated stress tests, as described in Test Method F 1260M, to characterize the failure distribution of interconnect metallizations that fail due to electromigration.

1.2 This guide is restricted to structures with a straight test line on a flat surface that are used to detect failures due to an open-circuit or a percent-increase in resistance of the test line.

1.3 This guide is not intended for testing metal lines whose widths are approximately equal to or less than the estimated mean size of the metal grains in the metallization line.

1.4 This guide is not intended for test structures used to detect random defects in a metallization line.

1.5 Metallizations tested and characterized are those that are used in microelectronic circuits and devices.

Committee
F 01
DocumentType
Guide
Pages
2
ProductNote
Reconfirmed 2003
PublisherName
American Society for Testing and Materials
Status
Withdrawn
Supersedes

ASTM F 1260M : 1996 Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]

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PDF - English
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