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IEC 62276:2016

Current

Current

The latest, up-to-date edition.

Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

10-24-2016

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements
5 Sampling plan
6 Test methods
7 Identification, labelling, packaging, delivery condition
8 Measurement of Curie temperature
9 Measurement of lattice constant (Bond method)
10 Measurement of face angle by X-ray
11 Measurement of bulk resistivity
12 Visual inspections - Front surface inspection method
Annex A (normative) - Expression using Euler angle description
        for piezoelectric single crystals
Annex B (informative) - Manufacturing process for SAW wafers
Bibliography

IEC 62276:2016 applies to the manufacture of synthetic quartz, lithium niobate (LN), lithium tantalate (LT), lithium tetraborate (LBO), and lanthanum gallium silicate (LGS) single crystal wafers intended for use as substrates in the manufacture of surface acoustic wave (SAW) filters and resonators. This edition includes the following significant technical changes with respect to the previous edition:
- Corrections of Euler angle indications in Table 1 and axis directions in Figure 3.
- Definition of "twin" is not explained clearly enough in 3.3.3. Therefore it is revised by a more detailed definition.
- Etch channels maximum number at quartz wafer of seed which do not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with less etch channels in seeds to reduce defects of devices. The classification of etch channels in seed may prompt a rise in quartz wafer quality.

Committee
TC 49
DevelopmentNote
Supersedes IEC PAS 62276 (05/2005) Stability Date: 2018. (10/2016)
DocumentType
Standard
Pages
39
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
NEN EN IEC 62276 : 2016 Identical
PN EN 62276 : 2017 Identical
SN EN 62276 : 2016 Identical
UNE-EN 62276:2016 Identical
BS EN 62276:2016 Identical
CEI EN 62276 : 2013 Identical
EN 62276:2016 Identical
DIN EN 62276:2015-04 (Draft) Identical

IEC 63041-2:2017 Piezoelectric sensors - Part 2: Chemical and biochemical sensors
I.S. EN IEC 63041-1:2018 PIEZOELECTRIC SENSORS - PART 1: GENERIC SPECIFICATIONS
EN IEC 63041-1:2018 Piezoelectric sensors - Part 1: Generic specifications
IEC TS 61994-4-4:2010 Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 4-4: Materials - Materials for surface acoustic wave (SAW) devices
DD IEC/TS 61994-4-4:2010 Piezoelectric and dielectric devices for frequency control and selection. Glossary Materials Materials for surface acoustic wave (SAW) devices
I.S. EN IEC 63041-2:2018 PIEZOELECTRIC SENSORS - PART 2: CHEMICAL AND BIOCHEMICAL SENSORS
IEC 63041-1:2017 Piezoelectric sensors - Part 1: Generic specifications
EN IEC 63041-2:2018 Piezoelectric Sensors - Part 2: Chemical and Biochemical Sensors

ISO 4287:1997 Geometrical Product Specifications (GPS) — Surface texture: Profile method — Terms, definitions and surface texture parameters
IEC 61019-1:2004 Surface acoustic wave (SAW) resonators - Part 1: Generic specification
IEC 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification
IEC 60758:2016 Synthetic quartz crystal - Specifications and guidelines for use
IEC 61019-2:2005 Surface acoustic wave (SAW) resonators - Part 2: Guide to the use
IEC 60862-2:2012 Surface acoustic wave (SAW) filters of assessed quality - Part 2: Guidelines for the use
IEC 60862-3:2003 Surface acoustic wave (SAW) filters of assessed quality - Part 3: Standard outlines
IEC 61019-3:1991 Surface acoustic wave (SAW) resonators - Part 3: Standard outlines and lead connections

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